Advanced digital printing of electronics - Testing & validation of printed electronics

Zachary J. Davis

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Advanced digital printing of electronics - Testing & validation of printed electronics

Danish Technological Institute (DTI) has a range of testing equipment and facilities, focused on both short term and long-term testing and validations. DTI also has experience with material and high-resolution microscopy, which can be useful for finding the causes of device failures.  

Some of the testing and validation services are: 

C033_NRN_#1_6_0.1In-situ environmental testing – DTI has a fully automated climate chamber, with room for hundreds of printed sensors.  

 

We offer:

  • Temparature/humidity range 2°C - 80 °C, and relative humidity 5-90%
  • On line testing of over 30 DC and AC measurements, data accessible through cloud access 
  • RF measurements up to 3GHz and antenna testing
  • Mechanical bending & stretch testing

 

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Electro/Mechanical testing – DTI can perform automated stretching and bending testing, while monitoring electrical properties. Furthermore, DTI can combine this with optical microscopy to provide information of cracking and other failure points.

 

 

    

C033_NRN_#6_2µCT 3D imaging – using high resolution X-ray technology, one can obtain 3D images inside electronics.  

  • Energy: 25-100 kV 
  • Voxelsize 1-25 µm, dependent on sample size 
  • 11 MP camera  
  • Sample size: 1-25 mm in diameter  
  • Al og Al+Cu filter for samples with large densities  
  • Acquisition time between 15 min and 16 hours depending on material density and resolution  

 

FIB-SEM analysis C033_NRN_#6_3– In order to obtain ultra-high resolution information about your printed layers, FIB-SEM is the perfect tool. Here we can provide information about porosity, thickness, voids, particle sizes, etc.  

Images show an ink-jet printed nano silver layer on top of a paper substrate, just before and after photonic sintering. One can see how the Ag nanoparticles melt together to form a highly conductive layer after the sintering step.